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1 record found for Mohini Pendse

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AKA (Aliases, nicknames, alternate spellings, married and/or maiden names):

  • dattatraya r pendse
  • mohini r pendse
  • pendse r mohini
  • pendse r raj
  • pendse rajendra d
  • raj d pendse
  • raj r pendse
  • rajendra d pednse
  • rajendra dat pendse
  • rajendra dattatraya pendse
  • rajendra r pendse

Possible Relatives

Possible User IDs

  • 6/26/a22@linkedin
  • 17969210@linkedin
  • #a220266@linkedin

Associated Email Addresses

  • xxxxxx@aol.com
  • xxxxxx@att.net
  • xxxxxx@hotmail.com
  • xxxxxx@swbell.net
  • xxxxxxx@address.com
  • xxxxxxx@aol.com
  • xxxxxxx@earthlink.net
  • xxxxxxx@fb.com
  • xxxxxxxx@hotmail.com
  • xxxxxxxxxx@fb.com
  • xxxxxxxxxx@statschippac.com
  • xxxxxxxxxxxx@comcast.net
  • xxxxxxxxxxxx@socal.rr.com
See full email addresses →

Last Known Phone Numbers

(510) 792-4051 (Primary Phone)

landline

pacific bell telephone company (at&t california)

(510) 676-8469

mobile

new cingular wireless pcs llc (at&t mobility)

Jobs

  • Facebook Architect Silicon Packaging, Facebook Reality Labs (Frl) at Facebook (Since 2018)
  • Qualcomm Snr Director/Vice President, Package Architecture &Amp; Technology Development at Qualcomm (2015-2018)
  • Qualcomm Vice President/Snr Director, Technology at Qualcomm (Since 2015)
  • Qualcomm Vice President, Package Engineering at Qualcomm (Since 2015)
  • Qualcomm Senior Director, Package Architecture &Amp; Technology Development at Qualcomm (Since 2015)
  • Statschippac Vice President &Amp; Chief Marketing Officer at Statschippac (1999-2015)
  • Statschippac Vice President, Advanced Packaging at Statschippac (1999-2015)
  • Hewlett Packard Enterprise Packaging Technologist at Hewlett Packard Enterprise (1989-1999)
  • Hewlett-Packard Labs Snr Pacakging Technologist at Hewlett-Packard Labs (1989-1999)
  • Hewlett-Packard Labs Manager of Pacakge Development at Hewlett-Packard Labs (1989-1999)
  • National Semiconductor Snr Engineer/ Manager at National Semiconductor (1985-1989)
  • National Semiconductor Section Head at National Semiconductor (1985-1989)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2004-2004)
  • Stats Chippac, Inc. Stats Chippac, Inc. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2009-2009)
  • Stats Chippac, Ltd. Stats Chippac, Ltd. (2010-2010)
  • Facebook
  • Facebook
  • Qualcomm
  • Statschippac
  • Hewlett Packard Enterprise
  • National Semiconductor

Education

  • B.Tech, Materials Science, First in Class from Indian Institute of Technology, Bombay
  • Phd, Materials Science from University of California, Berkeley

Last Known Address

5245 Diamond Cmn
Fremont, California 94555

Alameda

Past Addresses

Homes, rental properties, businesses, apartments, condos and/or other real estate associated with Mohini Pendse.

  • 854 Fruitvale Ave
    Oakland, California 94601
  • 47400 Kato RD
    Fremont, California 94538

Job History

  • Mohini Pendse
    Architect Silicon Packaging, Facebook Reality Labs (Frl)

    Facebook

  • Mohini Pendse
    Director, Silicon Packaging, Facebook Reality Labs (Frl)

    Facebook

  • Mohini Pendse
    Manager of Pacakge Development

    Hewlett-Packard Labs

  • Mohini Pendse
    Mohini Pendse Found - Phone Numbers, Addresses &Amp; Possible Relatives | Zabasearch

    Stats Chippac, Inc.

  • Mohini Pendse
    Mohini Pendse Found - Phone Numbers, Addresses &Amp; Possible Relatives | Zabasearch

    Stats Chippac, Ltd.

  • Mohini Pendse
    Packaging Technologist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Research Scientist

    Hewlett Packard Enterprise

  • Mohini Pendse
    Section Head

    National Semiconductor

  • Mohini Pendse
    Senior Director, Package Architecture &Amp; Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Director/Vice President, Package Architecture &Amp; Technology Development

    Qualcomm

  • Mohini Pendse
    Snr Engineer/ Manager

    National Semiconductor

  • Mohini Pendse
    Snr Pacakging Technologist

    Hewlett-Packard Labs

  • Mohini Pendse
    Vice President &Amp; Chief Marketing Officer

    Statschippac

  • Mohini Pendse
    Vice President/Snr Director, Technology

    Qualcomm

  • Mohini Pendse
    Vice President, Advanced Packaging

    Statschippac

  • Mohini Pendse
    Vice President, Package Architecture &Amp; Technology Development

    Qualcomm

  • Mohini Pendse
    Vice President, Package Engineering

    Qualcomm

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